Ceramic PCB
High Thermal Conductivity

Ceramic PCB


Why ceramic PCB so popular at now?With the development of highly integrated circuit boards. highly integrated packaging modules require a good thermal bearing system. whereas the thermal conductivity disadvantage of traditional circuit boards. FR-4 and CEM-3 has limited the development of electronic technology. Line substrates in the field of high-power LED lighting using materials with good thermal performance. such as metals and ceramics. The high thermal conductivity aluminum substrates is 1-4 W/M.K. . whereas ceramic substrates can reach approximately 220 W/M.K. . Ceramic materials compare to FR-4, have good high frequency performance and electrical properties. as well as high thermal conductivity, excellent chemical stability, and thermal stability. It’s the perfect material for the  large-scale integrated circuits and power electronic modules.

What is a ceramic PCB?

Ceramic PCBs, also known as ceramic substrates, are ceramic boards that have multiple or multi-layer lines on one side. The circuit board has good thermal conductivity, airtightness, insulation, and electrical properties. Ceramic circuit boards made of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrates. Ceramic alumina or ceramic aluminum nitride circuit boards have excellent electrical insulation properties. high thermal conductivity, excellent soft brazing, and high adhesion strength. and easily etching out like a traditional PCB with a variety of graphics and a large current carrying capacity. Aluminum nitride ceramic PCB and alumina ceramic circuit boards are separated by material. That divided into dpc and dbc ceramic boards by process Single and double-sided . as well as multi-layer ceramic circuit boards, and divided based on the number of layers.

Popular of Ceramic PCB

thick film ceramic PCB

PCB with a single alignment layer on one side.

high temperature ceramic pcb

PCBs with two alignment layers on the same side.


PCBs have two alignment layers on each side.

Benefits of Ceramic Substrate PCB

1.Stable Shape
The majority of the substrate material is glass fiber FR-4. phenolic resin FR-3. aluminum base, copper base, PTFE, composite ceramic, and other materials. and the adhesive is usually phenolic, epoxy, and other materials. It is easy for PCB board warpage to occur during the PCB processing.  due to thermal stress, chemical factors, improper production process. or in the design process due to asymmetry of copper laying on both sides.
Ceramic circuit board is bonded together by magnetron sputtering copper and substrate. strong bonding, copper foil will not fall off. high reliability, and thus avoids the warpage of ordinary PCB.
2.Loading Capacity
100A continuous current through a 1mm-0.3mm thick copper body causes a temperature rise of approximately 17°C. 100A continuous current through a 2mm-0.3mm thick copper body causes a temperature rise of approximately 5°C.
3.Thermoelectric Conductivity
Ceramic PCB with alumina thermal conductivity can achieve 15-35. while aluminum nitride can achieve 170-230. Because high bond strength will also match the coefficient of thermal expansion. the tensile strength test value can reach 45 MPa.
4.Thermal Conductivity
The thermal conductivity of a high thermal conductivity aluminum substrate is typically 1-4W/M.K. . whereas the thermal conductivity of a ceramic substrate can reach approximately 220W/M.K.. depending on preparation and material formulation.
5.Reduce Thermal Resistance
Thermal resistance of a 10mm ceramic substrate 0.63mm ceramic substrate thermal resistance of 0.31K/W. 0.38mm ceramic substrate thermal resistance of 0.19K/W, 0.25mm ceramic substrate thermal resistance of 0.14K/W
6.High voltage resistance
To protect personal safety and equipment,  using bonding technology, the copper foil will not fall off. high reliability, stable performance in high temperature. and humidity environments . stable high frequency performance with lower AK and DK values than PTFE.

Type of Basic Materials

silicon nitride PCB

Silicon Nitride PCB

Silicon Carbide Ceramic PCB

Silicon Carbide Ceramic PCB

Production Methodology of Ceramic Substrate PCB


DPC-processed high-density ceramic circuit board This process can achieve precision lines, line width line spacing can be 0.05mm or even smaller, depending on the need to do pads, electrodes, gold lines, and so on. DPC thin film ceramic circuit board, the general metal layer to do more thin, but also to facilitate precision wiring and other production requirements.


More DBC or AMB process for high thermal conductivity, high insulation substrate Copper is frequently made of copper-clad boards, and because the copper layer is thicker, metal bonding requirements are higher. If the metal bonding requirements are more stringent, use the AMB production process, which typically employs an aluminum nitride ceramic substrate or a silicon nitride ceramic substrate to produce AMB ceramic copper clad board. The AMB production process can be accomplished using AMB ceramic copper clad metal bonding, 800um or lower.


The process is complex, requiring more HTCC high-temperature co-fired process or the use of LTCC low-temperature co-fired process to achieve multi-layer interconnection. When applied to high-power devices, for example, high-frequency ceramic circuit boards, more LTCC low-temperature co-fired process, low-temperature co-fired LTCC process can achieve the complex requirements of semiconductor devices passive device integration. LTCC is better suited to the field of high-frequency communication.

Types of Ceramic PCB


High Speed Ceramic PCB

High Frequency Ceramic PCB

High Frequency Ceramic PCB

Multiayer Ceramic PCB

Multiayer Ceramic PCB

Applications of Ceramic PCB

Power supply

Semiconductor Cooler

DC-DC converters, voltage regulators, high density power conversion and switching regulators.

led application

spotlights, high current PCBs, high current LEDs, street safety applications and all applications that use LEDs.

Automotive industry

High Power Semiconductor Module

Power regulators, ignition tools, switching converters, variable optics and electric motors for electric and hybrid vehicles.

Wireless Electronics

Power Control PCB

IC arrays, semiconductor heat shields, IC carrier chips, solar cell substrates, heat sinks and semiconductor cooling devices.

Audio equipment

Audio Devices

Balanced, input and output, audio, power and pre-shielded amplifiers.

Household appliances: flat panel displays, motor controls.

The Key Process of Ceramic PCB Production

Ceramic substrates are easily broken when compared to glass fiber boards. and the process is much more difficult and technical when compared to ordinary pcb boards. DPC is gradually replacing traditional LTCC and DBC technologies. while laser technology is more in line with high density interconnection of PCB . and the development of refinement. Ceramic circuit boards produced by laser punching have high ceramic and metal bonding strength. no peeling or blistering, and a long-lasting effect with high surface flatness and roughness of 0.1m to 0.3m.
Copper Cladding
The process of applying copper foil to unrouted areas of a circuit board . and connecting it to ground to increase ground surface area. reduce loop surface area, voltage drop, and improve power efficiency . and immunity as copper cladding. Copper cladding can reduce the loop cross-sectional area and improve the signal mirror loop. in addition to lowering the ground impedance. Incomplete, truncated mirror loops or positioned copper layers can frequently introduce new interferences . and impair board performance. Electroplating and sputtering are commonly used in the DPC process to form an adhesion layer of chromium or titanium . and a substrate layer of copper on the surface of the ceramic in sequence. The adhesion layer strengthens the metal circuit’s adhesion. while the copper substrate layer acts as a conductive layer.
The circuit pattern is pre-plated with a lead-tin resist layer. and then the unprotected non-conductor portion of the copper is chemically etched away to form the circuit. Depending on the process, etching has inner etching and outer etching. The inner layer used’acid etching with wet or dry film as resist. while the outer layer using alkaline etching with tin-lead as resist.
1. Alkaline etching process for ceramic-based circuit boards
Film removal:
The film removed from the circuit board surface using a film removal solution. to reveal the unprocessed copper surface.
Use etching solution to etch off the unwanted base copper. leaving the thickened lines. Accelerators to promote the oxidation reaction and prevent precipitation of copper substrates. shore protection agents to reduce side etching. and depressants to suppress ammonia dispersion, copper precipitation. and to accelerate the oxidation reaction of etched copper.
Fresh washing solution:
Use aqueous ammonia without copper ionization . and ammonium chloride solution to remove the residual solution from the plate.
This procedure is only applicable to the metallurgical process. The main purpose is to remove excess palladium ions from the non-plated through holes. to prevent the deposition of metallic ions in the metallizing process.
Tin Removal: Removal of the tin-lead layer using a nitric acid solution.
2. Ceramic-based circuit board acid copper chloride etching process
Using the weak alkalinity of sodium carbonate. dissolve the portion of the dry film that has not radiated by UV light while retaining the portion that has.
The copper surface exposed by dissolving the dry or wet film. etched with acidic copper chloride etching solution. depending on the percentage of the solution.
Film removal:
A specific percentage of chemical water to dissolve to protective film off the line at a specific temperature and speed. The etching speed of acid copper chloride is easily controlled. and the etching efficiency and quality are excellent. It is simple to control the etching speed.
How to improvement?
1. The fading of the film is not complete.Incomplete film removal caused by issues such as low water concentration, high speed, and clogged nozzles. As a result, the water concentration must checked and readjusted to the proper range. the speed and parameters adjusted in real time, and the nozzle unclogged.
2. Plate surface oxidation Because the concentration of water is too high. the temperature is too high, and so on. the plate surface will oxidize, so you must adjust the concentration of water and temperature .
3. Copper etching is not finished.Because the etching speed is too fast, the chemical water composition is incorrect. the copper surface contaminated, the nozzle is blocked. the temperature is low, so the copper etching is incomplete. As a result, the etching transport has a adjustable speed . the chemical water composition must be re-checked. copper surface contamination avoided the nozzle need to cleaned to prevent blockage. and the temperature adjustable, among other things.
4. The cost of copper etching is excessive.The machine speed is too slow, the temperature is too high. and so on, resulting in the phenomenon of excessive copper etching. so you should take measures to adjust the machine speed, temperature, and so on.

Trustworthy Ceramic PCB Manufacturer

Your Qualified Ceramic PCB Manufacturer

XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.

RFQ for Ceramic PCB

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