Ceramic PCB High Thermal Conductivity
Ceramic PCB
Introduction
Why ceramic PCB so popular at now？With the development of highly integrated circuit boards. highly integrated packaging modules require a good thermal bearing system. whereas the thermal conductivity disadvantage of traditional circuit boards. FR-4 and CEM-3 has limited the development of electronic technology. Line substrates in the field of high-power LED lighting using materials with good thermal performance. such as metals and ceramics. The high thermal conductivity aluminum substrates is 1-4 W/M.K. . whereas ceramic substrates can reach approximately 220 W/M.K. . Ceramic materials compare to FR-4, have good high frequency performance and electrical properties. as well as high thermal conductivity, excellent chemical stability, and thermal stability. It’s the perfect material for the large-scale integrated circuits and power electronic modules.
What is a ceramic PCB?
Ceramic PCBs, also known as ceramic substrates, are ceramic boards that have multiple or multi-layer lines on one side. The circuit board has good thermal conductivity, airtightness, insulation, and electrical properties. Ceramic circuit boards made of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrates. Ceramic alumina or ceramic aluminum nitride circuit boards have excellent electrical insulation properties. high thermal conductivity, excellent soft brazing, and high adhesion strength. and easily etching out like a traditional PCB with a variety of graphics and a large current carrying capacity. Aluminum nitride ceramic PCB and alumina ceramic circuit boards are separated by material. That divided into dpc and dbc ceramic boards by process Single and double-sided . as well as multi-layer ceramic circuit boards, and divided based on the number of layers.
Popular of Ceramic PCB
Benefits of Ceramic Substrate PCB
1.Stable Shape
2.Loading Capacity
3.Thermoelectric Conductivity
4.Thermal Conductivity
5.Reduce Thermal Resistance
6.High voltage resistance
Type of Basic Materials
Production Methodology of Ceramic Substrate PCB
DPC
DPC-processed high-density ceramic circuit board This process can achieve precision lines, line width line spacing can be 0.05mm or even smaller, depending on the need to do pads, electrodes, gold lines, and so on. DPC thin film ceramic circuit board, the general metal layer to do more thin, but also to facilitate precision wiring and other production requirements.
DBC or AMB
More DBC or AMB process for high thermal conductivity, high insulation substrate Copper is frequently made of copper-clad boards, and because the copper layer is thicker, metal bonding requirements are higher. If the metal bonding requirements are more stringent, use the AMB production process, which typically employs an aluminum nitride ceramic substrate or a silicon nitride ceramic substrate to produce AMB ceramic copper clad board. The AMB production process can be accomplished using AMB ceramic copper clad metal bonding, 800um or lower.
HTCC
The process is complex, requiring more HTCC high-temperature co-fired process or the use of LTCC low-temperature co-fired process to achieve multi-layer interconnection. When applied to high-power devices, for example, high-frequency ceramic circuit boards, more LTCC low-temperature co-fired process, low-temperature co-fired LTCC process can achieve the complex requirements of semiconductor devices passive device integration. LTCC is better suited to the field of high-frequency communication.
Types of Ceramic PCB
High Speed Ceramic PCB
High Frequency Ceramic PCB
Multiayer Ceramic PCB
Applications of Ceramic PCB
Semiconductor Cooler
DC-DC converters, voltage regulators, high density power conversion and switching regulators.
spotlights, high current PCBs, high current LEDs, street safety applications and all applications that use LEDs.
High Power Semiconductor Module
Power regulators, ignition tools, switching converters, variable optics and electric motors for electric and hybrid vehicles.
Power Control PCB
IC arrays, semiconductor heat shields, IC carrier chips, solar cell substrates, heat sinks and semiconductor cooling devices.
Audio Devices
Balanced, input and output, audio, power and pre-shielded amplifiers.
Household appliances: flat panel displays, motor controls.
The Key Process of Ceramic PCB Production
Drilling
Copper Cladding
1. Alkaline etching process for ceramic-based circuit boards
Film removal:
Etching:
Fresh washing solution:
Rectification:
2. Ceramic-based circuit board acid copper chloride etching process
Development:
Etching:
Film removal:
How to improvement?
Trustworthy Ceramic PCB Manufacturer
Your Qualified Ceramic PCB Manufacturer
XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.