15 Years High Frequency PCB Manufacturer
High Frequency PCB
What is a high frequency PCB?
High frequency PCB is a special circuit board with a high electromagnetic frequency. used for high frequency (frequency greater than 300 MHZ or wavelength less than 1 meter). microwave (frequency greater than 3 GHz or wavelength less than 0.1 meters) fields of PCB. It is the use of ordinary rigid circuit board manufacturing methods on the microwave substrate laminate part. Or the use of special processing methods and the production of circuit boards.
The Features of High-Frequency PCBs
High-frequency circuit board consumption is thanks to its small dielectric constant. so the consumption is smaller than other circuit boards.
The PCB high-frequency board using special materials. that not only ensure the dielectric constant of small quality,but also ensure the transmission speed at the same time. so that the board’s operation is stable.
The adjustable degree is large.
High-frequency PCB widely used in various industries for precision metal material heating processing . It can be focused on local characteristics of heating, whether surface or deep, centralized or decentralized heating method, can be easily completed.
High-frequency circuit boards are made of materials with very low water absorption. And can withstand moisture and high temperatures in humid environments. giving PCB circuit boards the advantage of resistance to chemical corrosion and great peel strength.
High-Frequency PCB Applications
- Mobile communication products.
- Power amplifier, low noise amplifier, etc.
- Power splitter, coupler, duplexer, filter, and other passive devices.
- Automobile collision avoidance systems, satellite systems, radio systems, and other fields. High-frequency electronic devices are the development trend.
Better Heat Transfer
High Frequency PCB Materials
Rogers High Frequency PCB
Taconic High Frequency PCB
PTFE High Frequency PCB
What are high-frequency materials?
Usually, high-frequency boards are made of materials with a high dielectric constantand low high-frequency loss. At present, the more used substrate for the high-frequency board is the fluorine-based dielectric substrate. such as polytetrafluoroethylene (PTFE), also known as Teflon, which is usually used above 5GHz. There are also FR-4 or PPO substrates, which can be used for products between 1GHz and 10GHz. The following is a comparison of the physical properties of these three types of high-frequency substrates.
At present, epoxy resin, PPO resin, and fluorine resin are the three types of high-frequency substrate materials used. Epoxy resin is the cheapest, while fluorine resin is the most expensive. and considering the dielectric constant, dielectric loss, water absorption, and frequency characteristics, fluorine resin is the best, while the epoxy resin is worse. When the product application frequency is higher than 10GHz, only fluorine resin printed board can be applied. Obviously, the performance of fluorine resin high-frequency substrate is much higher than other substrates. but its shortcomings, also to high cost, are poor rigidity and a large coefficient of thermal expansion. For polytetrafluoroethylene (PTFE), to improve the performance of a large number of inorganic substances . Such as silicon dioxide SiO2or glass cloth as a reinforcing filler material. That to improve the rigidity of the substrate and reduce its thermal expansion. In addition, because of the molecular inertia of the Teflon resin itself. it is not easy to bond with copper foil, so it needs special surface treatment with a copper foil bonding surface. There is chemical etching or plasma etching on the surface of PTFE to increase the surface roughness or adding a layer of adhesive film . between the copper foil and PTFE resin to improve the bonding force, but it may have an impact on the media performance.
With the rapid development of science and technology. more and more equipment designs are in the microwave band (> 1GHz) or even in the millimeter wave field (30GHz). which also means that the frequency is getting higher and higher requirements for the substrate material of the circuit board. For example, the substrate material needs to have excellent electrical properties, and good chemical stability. with the increase in power signal frequency in the substrate material loss requirements are very small. The emergence of 5G signal, so the importance of high-frequency plate comes to the fore.
Types of High Frequency PCB Materials
Rogers Rogers: RO4003, RO3003, RO4350, RO5880, etc.
Taiyao TUC: Tuc862, 872SLK, 883, 933, etc.
Isola: FR408HR, IS620, IS680, etc.
Nelco: N4000-13, N4000-13EPSI, etc.
Dongguan Shengyi, Taizhou Wangling, Taixing Microwave, etc.
High-Frequency Board Production Capability
|High-Frequency PCB Capabilities
|High-frequency PCB types
|6GHz to 24GHz PCBs, 70GHz PCBs, embedded antenna PCBs Copper/ceramic hybrid base high-frequency PCBs, PTFE-based high-frequency PCBs
|Finished PCB thickness
|0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
|Base copper thickness
|Normally 0.5oz and 1.0oz
|Conductor width control
|Maximum impedance control tolerance
|1W/mK to 9W/mK
|Blind vias, overlapping vias, staggered vias, skip vias, buried vias
|10 seconds at 288°C
|ε2.1 to ε10.0
|Punching or routing tolerance
|±0.10mm to 0.13mm
|Hole wall copper
|Solder mask ink
|Taiyo PSR4000, Tamura DSR2200
|Solder mask thickness on traces
|20μm to 30μm
Trustworthy High Frequency PCB Manufacturer
Your Qualified High Frenquency PCB Manufacturer
XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.
High Frequency PCB Design
Our engineers compensate for the alignment width. according to different copper thicknesses and measure the copper thickness. after etching to confirm that it is within the tolerance range of ±0.02mm (but it can even be ±0.015mm).
After the film is drawn, we check to make sure there are no pinholes or gaps in the film. Defects such as pits, gaps, and pinholes in the line will affect the transmission effect. and high-frequency PCBs do not allow such small defects.
We use the chemical copper plasma method, which is the most difficult process in high-frequency PCB manufacturing. All holes must have copper and we do not allow blanks. We inject carbon tetrafluoride (CF4) or argon (Ar2), nitrogen (N₂), and oxygen (O₂). between two high voltage electrodes in a vacuum environment and place the HF PCB between the two electrodes. In this way, plasma is formed in the cavity to remove drilling dirt and grime from the borehole.
Soldermask thickness is also strictly controlled. Because lines of a few microns are too thick or too thin solder resist layers may be disqualified.
The final destructive test is performed during the manufacturing process: 288°C thermal shocks for 10 seconds. in order to 1 to 3 times, to ensure that the hole walls do not separate.
In addition, XFDC-PCB engineers will fully coordinate with you during your high-frequency PCB project. Properly understand your needs and product features. and provide you with useful suggestions for improvement to manufacturing satisfactory high-frequency PCBs.