Multilayer PCB -
XFDC PCB Manufacturer
Leading Multilayer PCB Manufacturer in China
IF you are looking for a reliable multilayer PCB supplier. XFDC-PCB has 22 years of experience in PCB manufacturing.
We could manufacture various multilayer PCB according to customer requirements.
Supply prototype of multilayer PCB as the sample for test.
We will quote the most competitive price within 1-2 hours when we received the customer Gerber file.
Multilayer PCB Series
4 Layer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
6 Layer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
8 Layer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
10 Layer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
12 Layer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
14 Layer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
Multi-layer PCB By Type
HDI Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
Flexible Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
Rigid-Flex Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
Multilayer PCB Board By Copper Thickness
4OZ Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
10 OZ Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
20 OZ Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
Multi-layer PCB By Material
RF4 Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
CEM-3 Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
High Tg PCB Multilayer PCB
4 layer multilayer PCB is made of four layers of glass fiber. The wiring is divided into four layers: top, bottom, VCC, and GND. To connect the layers, through holes, buried holes, and blind holes are commonly used. More buried and blind holes exist than double-sided boards.
XFDC-PCB Multilayer PCB Tolerance
There are many tolerances in the multilayer PCB manufacturing process, therefore,we control the specifications within the tolerance. Typically,
follows I PC class 2 or class 3 for quality control. You will see the standard tolerance as follows:
• Board thickness: +/-10%
• PTH hole: +/-0.075mmm
• NPTH hole: +/-0.05mm
• Press-fit hole: +/-0.05mm
• Outline Registration: +/-0.1mm
• The remaining thickness of V-scoring: +/-0.1mm
XFDC-PCB
Multilayer PCB Productions
XFDC-PCB has the advanced equipment to produce the first-class multilayer PCB. There are many manufacturing processes, you will see the details as follows:
Cutting materials – Inner layer – Laminating with outer layer – Drilling – Plating
through the hole – Pattern exposing & developing – Pattern plating – Etching –
Soldermask exposing& developing – Silkscreen print – Surface finish – CNC – Testing –
FQC – Packing – Shipment.
PCB Manufacturing Process Capabilities
ISO450012018
ISO140012015
ISO90012015
UL
| Features | Standerd PCB | Advanced PCB |
|---|---|---|
| Material | FR-4 (Tg-135C, 145C, 170C), Halogen- free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core | |
| Board Thickness | 0.020″-0.125″ | 0.005″-0.250″ |
| Maximum Board Size | 16″ x 22″ | 10″ x 16″ |
| 16″ x 22″ | ||
| 12″ x 21″ | 12″ x 21″ | |
| 22″ x 28″ | 22″ x 28″ | |
| Minimum Core Thickness | 0.004″ | 0.002″ |
| Copper Thickness | 0.5 ~4 oz | 0.25~6 oz |
| Minimum Trace Width / Spacing | 0.004″/0.004″ | 0.003″/0.003″ |
| Solder Mask Color | Green, Blue, Black, Red, Yellow, White, Clear, and customized | |
| Silkscreen Color | White, Black, Yellow, Green, Red, Blue and customized | |
| Minimum Hole Size | 0.008″ | 0.004″ |
| Finished Hole Size Tolerance | +/-0.003″ | +/-0.002″ |
| PCB Surface Finish | HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG,HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold | |
| Controlled Impedance Tolerance | +/-10 % | +/-5 % |
| Aspect Ratio | 8/1 | 1/15 |
| Quality Standards | IPC Class 2 ISO 9001: 2008 ISO/TS16949: 2009 UL 94v0 | |
| Other Tech | Blind Vias Carbon Ink Peelable Mask Solder Sample First Article | |
OEM Multilayer PCB Application
Multilayer PCB for Medical Applications
The Multilayer PCB for Medical &Beauty Applications are usually high-tech boards, such as HDI circuit boards, flexible circuit boards, and rigid-flex PCBs. What’s more, they have via’s plugging with resin epoxy and plating over.
Multilayer PCB for 5G Applications
- XFDC-PCB has served many customers who produce Smartphones, tablets, radios, and other communications products, we have supplied OEM Multilayer PCB manufacturing services for more than 20 years.
Multilayer PCB for Automotive Applications
Depending on Automotive Applications more and more popular for the environment, a PCB may need to be able to withstand extreme temperatures or vibrations. It’s also critical that they work reliably if they’re part of a car’s safety features. Manufacturers may use high-temperature laminates, aluminum or copper substrates, or thru-hole-mounted components as a result of these challenges. They also use flex-rigid PCBs because of their vibration resistance.
Multilayer PCB for LED Applications
Multilayer PCB plays in LED applications to transfer heat away from the bulb. LEDs have a shorter average life when exposed to high temperatures. As a result, LED PCBs are typically made of aluminum, which can transfer heat better than other metals. This eliminates the need for a second heat sink in a design, allowing it to be more compact.
Why Choose XFDC Multilayer PCB
Xinfeng Dacheng is a PCB manufacturer. specializing in the production of single-layer flex PCB,fr4 2 layer PCB,4 layer PCB, and 6 layer PCB.
And founded in 1999, over 22 years for pcb fabrication, fast printed pcb ,and pcb manufacturing . the company is the first batch of PCB fabrication manufacturers in China.We supply a One-stop solution for PCB manufacturing. With the rapid development, we are expanding our production capacity.Now the existing equipment capacity can complete an annual production capacity of 1 million square meters.