Durability & Effectiveness Tg130 PCB
FR4 TG130 Printed Circuit Board
Introduction
A practical circuit board, the TG130 PCB has a glass transition temperature of 130°C. In other words, this is a typical TG value for printed circuit boards. The material is FR4 (Flame Retarding Grade 4).
This PCB material begins to deform at 130°C. Throughout its service life, TG130 PCB provides excellent functionality and mechanical stability. For rigid PCB applications, FR4 is a well-known material.
Consequently, this PCB is compatible with an extensive variety of electronic projects. It performs optimally between 100 and 1100 Celsius. It is essential to note that the operating temperature of this device never exceeds this TG value.
There are several varieties of TG130 circuit boards available on the market. PCB rigidity is one example. Such as Multilayer PCB, PCB Prototype, TG130 PCB Halogen-Free, etc.
Details of TG130 PCB

- Board material: FR4
- Number of layers:1-16 layers
- Board thickness:1.6±0.16mm
- Size:196mm*182mm
- Minimum hole diameter: 0.2mm
- Minimum line width line spacing: 4mil/4mil
- Average thickness of hole copper: 25um
- Surface copper thickness: 56um
- Surface treatment: Immersion gold
- Hole to conductor minimum spacing: 10mil
Related Tg130 PCB Series

FR4 TG130 PCB

RIGID TG130 PCB

Multilayer TG130 PCB
What Characteristics Does the TG130 PCB ?
- Extremely strong tensile strength.
- Low arc resistance.
- Halogen-free
- Reliability of through-hole plating
- The quick absorption of water
- Low dielectric strength.
- Dielectric strength is extremely strong.
- Low surface resistivity
- UL 94 V-0 certification
- Low peel strength.
- Considerable thermal conduction

The TG130 PCB characteristics are suitable for a wide variety of applications. Its specifications combine temperature control, durability, and cost-effectiveness. The most distinguishing features of this circuit board are The board’s thickness varies between 0.5 and 3.2 mm. Extremely strong tensile strength.
These characteristics are dependent on the board’s thickness and glass transition temperature. A PCB with a standard TG value is dependable for guaranteeing high standards. Consequently, its compatibility with different electronic fields is commendable.
Related of High Tg PCB
Tg130 PCB VS. Tg170 PCB
Both of these circuit boards have pros and cons that are easy to see. We’re here to talk about how these two PCBs are alike and different. Let’s have a look.
Cost Effectiveness
When compared to a TG170 PCB, it costs less. It costs less to make because the materials are cheaper and the size of the board helps keep costs down. But high TG PCBs are expensive because their materials are expensive and their designs are hard to make.
Environment Friendly
Most of the TG130 printed circuit board bases are made of phosphorous. They have less halogen than the others. So, these PCBs without halogens are very good for the environment. On the other hand, from an environmental point of view, TG170 PCBs are not as good as standard TG circuit boards.
Stability of the machine
Stable mechanical properties are ensured by a higher glass transition temperature. Because of this, the performance of standard PCB TG130 is less stable than that of TG170. But standard TG is also good for many uses where high rigidity is not needed.
Thermal Management
Taking care of the heat TG130 PCB is an inexpensive way to get the right thermal expansion and temperature resistance. With a low TG PCB, you have to keep the operating temperature low. But for better thermal management, you should think about high TG circuit boards.
Your Qualified Tg130 PCB Manufacturer

XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.
What Factors Need to Consider Selecting Tg130 PCB?
When selecting TG130 PCB materials, several factors must be considered.
- Tensile dielectric strength
- Thermal enlargement
- Temperature tolerance
- Characteristics of adhesion
- Allowability relative
- Tensile Force Adaptability
The temperature of disintegration The substrate of the TG130 printed circuit board is FR4. FR4 offers sufficient resistance to both fire and water. It has excellent electrical and mechanical properties for applications involving high-speed PCBs. In addition, its tensile strength is appropriate for rigid electronic devices. Its strength-to-weight ratio is also advantageous for a variety of modern electronic devices. In order to obtain the best results from this PCB, proper consideration of these issues is necessary.
Tg130 PCB Manufacturing Process Capabilities












Features | Standerd PCB | Advanced PCB |
---|---|---|
Material | FR-4 (Tg-135C, 145C, 170C), Halogen- free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Teflon Black FR-4 Arlon AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT Epoxy Nelco 4013 PTFE Metal Core Materials Aluminum Core | |
Board Thickness | 0.020″-0.125″ | 0.005″-0.250″ |
Maximum Board Size | 16″ x 22″ | 10″ x 16″ |
16″ x 22″ | ||
12″ x 21″ | 12″ x 21″ | |
22″ x 28″ | 22″ x 28″ | |
Minimum Core Thickness | 0.004″ | 0.002″ |
Copper Thickness | 0.5 ~4 oz | 0.25~6 oz |
Minimum Trace Width / Spacing | 0.004″/0.004″ | 0.003″/0.003″ |
Solder Mask Color | Green, Blue, Black, Red, Yellow, White, Clear, and customized | |
Silkscreen Color | White, Black, Yellow, Green, Red, Blue and customized | |
Minimum Hole Size | 0.008″ | 0.004″ |
Finished Hole Size Tolerance | +/-0.003″ | +/-0.002″ |
PCB Surface Finish | HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG,HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon Ink, Hard Gold(Flash Gold), Soft Gold | |
Controlled Impedance Tolerance | +/-10 % | +/-5 % |
Aspect Ratio | 8/1 | 1/15 |
Quality Standards | IPC Class 2 ISO 9001: 2008 ISO/TS16949: 2009 UL 94v0 | |
Other Tech | Blind Vias Carbon Ink Peelable Mask Solder Sample First Article |
Let Talk About Your Project Now!
Contact Info
- +86-411- 86715816
- Sales01@xfdc-pcb.com
- Xinfeng Industrial Park, Ganzhou City,
- Jiangxi Province
- +86 (0)15542312748