Thick Film Ceramic PCB
High Thermal Conductivity

Thick Film Ceramic PCB

The “Thick Film” refers to the conductor layer’s thickness on Ceramic PCBs. Typically, the thickness of Thin Film Ceramic PCB will exceed 10 microns (um). or 10-13um, making it thicker than spurting technology.

Using thick film technology, we can simultaneously apply resistor, electric capacity, conductor, semi-conductor. and interchangeable conductor to ceramic board. following printing and high temperature sintering manufacturing stages. On the same circuit board, resistors can have the same value or various values for each resistance.

Thick Film Ceramic Board Basic Dimensions

  • The substrate composed of 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO). with the following thicknesses: 0.25, 0.38, 0.50mm, 0.635mm (default thickness), 0.76mm, and 1.0mm. Additionally, thicker thicknesses, such as 1.6mm or 2.0mm, need customizable.
  • Conductor layer material is silver palladium, gold palladium, or Mo/Mu+Ni (for ozone);
  • Thickness of conductor >= 10 micron (um), with a 20 micron maximum thickness (0.02mm)
  • Minimum trace width and space for volume production:0.30mm & 0.30mm; 0.20mm / 0.20mm is acceptable. but will incur additional costs; 0.15mm / 0.20mm is only accessible for prototypes.
  • The final trace layout tolerance will be +/-10%.
  • More distinct resistor values on the same board will result in a more expensive board.
  • Normal layer thicknesses are 1L and 2L (with plated through hole (PTH) and plated material identical to that of the conductor). while the highest layer thickness is 10 layers.
  • Soldermask is also available upon request; its operating temperature exceeds 500 degrees Celsius. and its color is translucent.

Popular of Ceramic PCB

thick film ceramic PCB

PCB with a single alignment layer on one side.

high temperature ceramic pcb

High Temperature Ceramic PCB

PCBs with two alignment layers on the same side.


Low Temperature Ceramic PCB

PCBs have two alignment layers on each side.

Applications of Thick Film Ceramic PCB

High-power LED

High-power LED

DC-DC converters, voltage regulators, high density power conversion and switching regulators.

Hybrid integrated circuit for automotive

spotlights, high current PCBs, high current LEDs, street safety applications and all applications that use LEDs.

High bright light

High Bright Light

Power regulators, ignition tools, switching converters, variable optics and electric motors for electric and hybrid vehicles.

Automotive light system

Automotive Light System

IC arrays, semiconductor heat shields, IC carrier chips, solar cell substrates, heat sinks and semiconductor cooling devices.

Street light

Street Light

Balanced, input and output, audio, power and pre-shielded amplifiers.

Household appliances: flat panel displays, motor controls.

Benefits of Ceramic Substrate PCB

1.Stable Shape
The majority of the substrate material is glass fiber FR-4. phenolic resin FR-3. aluminum base, copper base, PTFE, composite ceramic, and other materials. and the adhesive is usually phenolic, epoxy, and other materials. It is easy for PCB board warpage to occur during the PCB processing.  due to thermal stress, chemical factors, improper production process. or in the design process due to asymmetry of copper laying on both sides.
Ceramic circuit board is bonded together by magnetron sputtering copper and substrate. strong bonding, copper foil will not fall off. high reliability, and thus avoids the warpage of ordinary PCB.
2.Loading Capacity
100A continuous current through a 1mm-0.3mm thick copper body causes a temperature rise of approximately 17°C. 100A continuous current through a 2mm-0.3mm thick copper body causes a temperature rise of approximately 5°C.
3.Thermoelectric Conductivity
Ceramic PCB with alumina thermal conductivity can achieve 15-35. while aluminum nitride can achieve 170-230. Because high bond strength will also match the coefficient of thermal expansion. the tensile strength test value can reach 45 MPa.
4.Thermal Conductivity
The thermal conductivity of a high thermal conductivity aluminum substrate is typically 1-4W/M.K. . whereas the thermal conductivity of a ceramic substrate can reach approximately 220W/M.K.. depending on preparation and material formulation.
5.Reduce Thermal Resistance
Thermal resistance of a 10mm ceramic substrate 0.63mm ceramic substrate thermal resistance of 0.31K/W. 0.38mm ceramic substrate thermal resistance of 0.19K/W, 0.25mm ceramic substrate thermal resistance of 0.14K/W
6.High voltage resistance
To protect personal safety and equipment,  using bonding technology, the copper foil will not fall off. high reliability, stable performance in high temperature. and humidity environments . stable high frequency performance with lower AK and DK values than PTFE.

Trustworthy Ceramic PCB Manufacturer

Your Qualified Ceramic PCB Manufacturer

XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.

Let Talk About Your Project Now!

    Contact Info

    • +86-411- 86715816
    • Xinfeng Industrial Park, Ganzhou City,
    • Jiangxi Province
    • +86 (0)15542312748