The main advantage of thin-film circuits over thick-film ceramic PCB is their smaller size. However, the manufacturing equipment is more expensive, and the production costs are higher. Thin-film Ceramic PCB is suitable for a wide range of circuits, particularly analog circuits that require high accuracy, stability, and performance. It is better suited for microwave circuits than other circuit boards. Method of Making Thin Film Ceramic Boards There are several methods for creating thin film layers, including the more common physical vapor deposition (PVD) and the less common anodic oxidation or electroplating. The evaporation and sputtering processes are the most commonly used in physical vapor deposition (PVD). Because both processes take place in a vacuum chamber, they are referred to as the “vacuum film-forming method.” Passive components, interconnect traces, insulation film, and protective film can be produced in a passive network using these two methods. A dielectric film can be produced and the resistance value of a film resistor can be adjusted using the anodic oxidation method. Electroplating can be used to increase the thickness of thin-film micro-strip lines in microwave hybrid integrated circuits to reduce power consumption.