Thin Film Ceramic PCB High Thermal Conductivity
Thin Film Ceramic PCB
When compared to “Thick Film Ceramic PCB,” “Thin Film” refers to the thinner thickness of the conductor layer on Ceramic PCB. Thin film Ceramic PCBs are typically less than 10 micron thick (10 um). It was paurting on a ceramic substrate/core. Evaporation, sputtering, electroplating, and other thin film manufacturing technology are used on the same substrate to produce a passive network, which is then assembled on micro-components, devices separately, and the hybrid integrated circuit formed by packaging. Thin film ceramic PCB is classified into lumped and distributed parameters based on the concentration and distribution of components in a passive network. The former applies to the low-frequency to microwave band, while the latter only to the microwave band.
Thin Film Ceramic Board Characteristics
The main advantage of thin-film circuits over thick-film ceramic PCB is their smaller size. However, the manufacturing equipment is more expensive, and the production costs are higher. Thin-film Ceramic PCB is suitable for a wide range of circuits, particularly analog circuits that require high accuracy, stability, and performance. It is better suited for microwave circuits than other circuit boards. Method of Making Thin Film Ceramic Boards There are several methods for creating thin film layers, including the more common physical vapor deposition (PVD) and the less common anodic oxidation or electroplating. The evaporation and sputtering processes are the most commonly used in physical vapor deposition (PVD). Because both processes take place in a vacuum chamber, they are referred to as the “vacuum film-forming method.” Passive components, interconnect traces, insulation film, and protective film can be produced in a passive network using these two methods. A dielectric film can be produced and the resistance value of a film resistor can be adjusted using the anodic oxidation method. Electroplating can be used to increase the thickness of thin-film micro-strip lines in microwave hybrid integrated circuits to reduce power consumption.
Popular of Ceramic PCB
PCB with a single alignment layer on one side.
PCBs with two alignment layers on the same side.
Low Temperature Ceramic PCB
PCBs have two alignment layers on each side.
Applications of Thi Film Ceramic PCB
DC-DC converters, voltage regulators, high density power conversion and switching regulators.
spotlights, high current PCBs, high current LEDs, street safety applications and all applications that use LEDs.
Thin Film Sensitive Elements
Power regulators, ignition tools, switching converters, variable optics and electric motors for electric and hybrid vehicles.
IC arrays, semiconductor heat shields, IC carrier chips, solar cell substrates, heat sinks and semiconductor cooling devices.
Thin Film Resistors
Balanced, input and output, audio, power and pre-shielded amplifiers.
Household appliances: flat panel displays, motor controls.
Benefits of Ceramic Substrate PCB
5.Reduce Thermal Resistance
6.High voltage resistance
Trustworthy Ceramic PCB Manufacturer
Your Qualified Ceramic PCB Manufacturer
XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.
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