Thin Film Ceramic PCB
High Thermal Conductivity

Thin Film Ceramic PCB

When compared to “Thick Film Ceramic PCB,” “Thin Film” refers to the thinner thickness of the conductor layer on Ceramic PCB. Thin film Ceramic PCBs are typically less than 10 micron thick (10 um). It was paurting on a ceramic substrate/core. Evaporation, sputtering, electroplating, and other thin film manufacturing technology are used on the same substrate to produce a passive network, which is then assembled on micro-components, devices separately, and the hybrid integrated circuit formed by packaging. Thin film ceramic PCB is classified into lumped and distributed parameters based on the concentration and distribution of components in a passive network. The former applies to the low-frequency to microwave band, while the latter only to the microwave band.

Thin Film Ceramic Board Characteristics

The main advantage of thin-film circuits over thick-film ceramic PCB is their smaller size. However, the manufacturing equipment is more expensive, and the production costs are higher. Thin-film Ceramic PCB is suitable for a wide range of circuits, particularly analog circuits that require high accuracy, stability, and performance. It is better suited for microwave circuits than other circuit boards. Method of Making Thin Film Ceramic Boards There are several methods for creating thin film layers, including the more common physical vapor deposition (PVD) and the less common anodic oxidation or electroplating. The evaporation and sputtering processes are the most commonly used in physical vapor deposition (PVD). Because both processes take place in a vacuum chamber, they are referred to as the “vacuum film-forming method.” Passive components, interconnect traces, insulation film, and protective film can be produced in a passive network using these two methods. A dielectric film can be produced and the resistance value of a film resistor can be adjusted using the anodic oxidation method. Electroplating can be used to increase the thickness of thin-film micro-strip lines in microwave hybrid integrated circuits to reduce power consumption.

Popular of Ceramic PCB

thick film ceramic PCB

PCB with a single alignment layer on one side.

high temperature ceramic pcb

PCBs with two alignment layers on the same side.

LOW TEMPERATURE Ceramic PCB

Low Temperature Ceramic PCB

PCBs have two alignment layers on each side.

Applications of Thi Film Ceramic PCB

High-power LED

High-power LED

DC-DC converters, voltage regulators, high density power conversion and switching regulators.

Medical cosmetology pcb

spotlights, high current PCBs, high current LEDs, street safety applications and all applications that use LEDs.

High bright light

Thin Film Sensitive Elements

Power regulators, ignition tools, switching converters, variable optics and electric motors for electric and hybrid vehicles.

Automotive light system

Solid-State Sensors

IC arrays, semiconductor heat shields, IC carrier chips, solar cell substrates, heat sinks and semiconductor cooling devices.

Street light

Thin Film Resistors

Balanced, input and output, audio, power and pre-shielded amplifiers.

Household appliances: flat panel displays, motor controls.

Benefits of Ceramic Substrate PCB

1.Stable Shape
 
The majority of the substrate material is glass fiber FR-4. phenolic resin FR-3. aluminum base, copper base, PTFE, composite ceramic, and other materials. and the adhesive is usually phenolic, epoxy, and other materials. It is easy for PCB board warpage to occur during the PCB processing.  due to thermal stress, chemical factors, improper production process. or in the design process due to asymmetry of copper laying on both sides.
 
Ceramic circuit board is bonded together by magnetron sputtering copper and substrate. strong bonding, copper foil will not fall off. high reliability, and thus avoids the warpage of ordinary PCB.
 
2.Loading Capacity
 
100A continuous current through a 1mm-0.3mm thick copper body causes a temperature rise of approximately 17°C. 100A continuous current through a 2mm-0.3mm thick copper body causes a temperature rise of approximately 5°C.
 
3.Thermoelectric Conductivity
 
Ceramic PCB with alumina thermal conductivity can achieve 15-35. while aluminum nitride can achieve 170-230. Because high bond strength will also match the coefficient of thermal expansion. the tensile strength test value can reach 45 MPa.
 
4.Thermal Conductivity
 
The thermal conductivity of a high thermal conductivity aluminum substrate is typically 1-4W/M.K. . whereas the thermal conductivity of a ceramic substrate can reach approximately 220W/M.K.. depending on preparation and material formulation.
 
5.Reduce Thermal Resistance
 
Thermal resistance of a 10mm ceramic substrate 0.63mm ceramic substrate thermal resistance of 0.31K/W. 0.38mm ceramic substrate thermal resistance of 0.19K/W, 0.25mm ceramic substrate thermal resistance of 0.14K/W
 
6.High voltage resistance
 
To protect personal safety and equipment,  using bonding technology, the copper foil will not fall off. high reliability, stable performance in high temperature. and humidity environments . stable high frequency performance with lower AK and DK values than PTFE.

Trustworthy Ceramic PCB Manufacturer

Your Qualified Ceramic PCB Manufacturer

XFDC-PCB has over 20 years of experience fabricating and assembling a wide range of PCBs, including rigid, flexible, rigid-flex PCBs,HDI PCB. Regardless of how simple or complex your requirement is, our cutting-edge equipment and expert team are well-equipped to handle it. When you collaborate with us, you gain access to a wealth of industry best practices that will give you an advantage. We are dedicated to providing quick turnaround times so that you can get to market as soon as possible. Our clients appreciate the fact that we provide prototype quantities as well as large production runs with the same unwavering focus on quality. You can also rely on us for turnkey services and be confident that you will receive high-quality results.

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